Fabrication of metallic air bridges using multiple-dose electron beam lithography

Abstract

The techniques of fabricating metallic air bridges using different resists in a one-step electron beam lithography are presented. The exposure process employed a single-layer polymethyl methacrylate (PMMA) or photoresists with either different doses in the span and feet areas or with varying acceleration voltage of the electron beam. The process using photoresists with different doses has produced air bridges more stable than what the PMMA method using various acceleration voltages would achieve. Using this method, air bridges up to 12μm long have been fabricated. The length and height of these metallic air bridges vary with the photoresist thickness.