Fabrication of MEMS Capacitive Pressure Sensor (MCPS) with Segmented Bossed Diaphragm

Abstract

MEMS capacitive pressure sensors can be used for touch mode applications with pressure ranging from 0.05 to 2 MPa (Ramesh AK, Ramesh P in Trade-off between sensitivity and dynamic range in designing MEMS capacitive pressure sensor, in TENCON 2015–2015 IEEE Region 10 Conference (IEEE, 2015)[1]). This paper explains about the fabrication of the MEMS Capacitive Pressure Sensor (MCPS) with bossed diaphragm as well as the modification made to the boss structure (Ramesh AK, Ramesh P in A segmented boss structure for MEMS capacitive sensor diaphragm. J. Micro-fab. MEMS (2015) [2]) in order to improve the sensor characteristics. Before that the fabrication of the boss structure is explained from which the segmented boss structure is obtained.