Fabrication of low-cost MEMS microfluidic devices using metal embossing technique on glass for lab-on-chip applications

Abstract

This paper discusses a low-cost technology for the fabrication of microfluidic devices on glass substrate using metal embossing technique. The fabrication technique demonstrated is a much simpler approach of embossing on glass using thermo-compression process with a patterned metal layer to define device structure. Well established printed circuit board fabrication photo-process is used to realize the desired planar geometry on metal layer deposited over a glass substrate. The depth of the channel is defined by the thickness of the metal deposited by electro-plating. The embossing technology offers a relatively safer approach conducive to batch processing to enable repeatable, high-yield, low-cost devices fabricated using low-cost equipment. Major challenges of achieving adhesion of the deposited thick nickel layer without peel-off and control of the thermo-compression process to achieve reliable and repeatable embossing without structural distortions were addressed. To prove its suitability for manufacturing, experiments were carried out with full wafer of 6″ × 6″ square glass wafer and optimal process steps for low-cost microfluidic device manufacturing have been well established.