Abstract
Abstract In this study, a sapphire lapping plate was fabricated using a unique blend of copper (Cu) metal particles and resin to overcome the drawbacks of traditional iron (Fe) and Cu plate lapping. An optimum Cu-resin ratio was found by evaluating the MRR, surface roughness of the lapped sapphire and the hardness of the Cu-resin plate. Cu-resin plates with various groove patterns were prepared, and a suitable pattern was found with respect to MRR and surface roughness of processed sapphire. A new concept of a temporary 2-body and permanent 3-body diamond abrasion mechanism was proposed for the sapphire lapping process using the interface of the Cu-resin plate. The proposed mechanism on sapphire lapping may support future developments in this field.
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