Fabrication of high-aspect-ratio microscale Ta mold inserts with micro electrical discharge machining

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We report fabrication of microscale Ta mold inserts by micro-electrical-discharge-machining (μEDM). Morphology, chemistry, and structure of the near-surface region of as-μEDMed Ta blanks have been characterized by scanning electron microscopy, X-ray photoelectron spectroscopy, and transmission electron microscopy. A TaC surface layer forms on as-μEDMed Ta surfaces. This altered surface layer was removed by electro-chemical-polishing. Further modification of Ta insert surfaces was accomplished by deposition of a conformal Ti-containing hydrogenated carbon coating. We demonstrate successful replication of high-aspect-ratio microscale structures in Al and Cu by compression molding with such surface-engineered Ta mold inserts.