Abstract

The fin field-effect transistor (FET) silicon nanocrystal floating gate memory using the photochemical vapor deposition and the plasma doping processes was proposed. The silicon nanocrystals with a uniform size were formed on a vertical sidewall surface of the fin channel by the photochemical vapor deposition. The plasma doping was applied to form the junctions at the sidewall of the fin source-drain extension regions with a high aspect ratio. The FinFET silicon nanocrystal floating gate memory with a gate length of 100nm was successfully fabricated and it revealed a memory effect as well as a suppressed short-channel effect.

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