Abstract
A new method of fabricating densely wound thin-film coils with high aspect ratios has been developed for thin-film magnetic heads. The processing steps are (1) thick polyimide resin spin coated on a substrate is patterned by reactive sputter etching using a finely patterned Mo mask; (2) conducting material of almost the same thickness as the polyimide resin is evaporated on to the patterned layer; (3) the Mo mask and conducting material formed on the Mo mask are selectively removed by electrochemical etching; and (4) polyimide resin is spin coated to smooth the surface of the coil layer. The Mo mask and polyimide resin can be patterned with an accuracy of better than 0.1 μm by selecting the appropriate etching conditions. A thick coil with 4 μm linewidth, 2 μm height, and 2 μm space between conductors can be produced and embedded in polyimide resin. The surface roughness of the resin over the coil is less than 0.2 μm.
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Schedule a callMore From: Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
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