Fabrication of a Large‐Area Hierarchical Structure Array by Combining Replica Molding and Atmospheric Pressure Plasma Etching

Abstract

A novel approach to produce a large‐area hierarchical structure array is presented. The method combines replica molding and atmospheric pressure plasma (APP) etching processes. Liquid blends consisting of siliconized silsesquioxane acrylate (Si‐SSQA), polyethylene glycol dimethacrylate (PEGDMA), and photoinitiator are used as roughness formable materials during APP etching. Microstructures composed of the Si‐SSQA/PEGDMA mixtures are fabricated by replica molding. Nanoroughness is realized on the microstructures by argon/oxygen (Ar/O2) APP etching in air. The nano­roughness on molded microstructures is efficiently controlled by varying the weight ratio of Si‐SSQA to PEGDMA and the etching time. The hierarchical structures fabricated by combining replica molding and Ar/O2 APP etching show superhydrophilicity with a long‐term stability, resulting in the formation of hydroxyl‐terminated silicon oxide layer with the reorientation limit. On the other hand, the hierarchical structures treated with a perfluorinated self‐assembled monolayer (SAM) show increased the water contact angles of up to 161° depending on the morphology of the hierarchical structures. The increment of water contact angles is consistent with increment of the nano‐/microroughness of hierarchical structures.