Abstract
A fabrication process has been developed which enables us to make matrix-addressable Mo-tip field-emitter arrays (FEAs) with 0.1 μm gate aperture and 0.2 μm tip-to-tip distance. An interferometric lithography combined with a trilevel resist process which uses an imaging resist layer, a silicon oxide interlayer, and antireflective coating has been implemented to fabricate the periodic structure of the gated FEAs in an addressable matrix. The matrix-addressable FEAs have shown a turn-on voltage as low as 13 V and an emission current density of 17 mA/cm2 at a gate voltage of 30 V.
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