Fabrication and thermo-physical properties of TiB 2p/Cu composites for electronic packaging applications

Abstract

TiB 2p/Cu composites with high reinforcement content ( ϕ p=50%, 58% and 65%) for electronic packaging applications were fabricated by squeeze casting technology. The microstructures and thermo-physical properties of the TiB 2p/Cu composites were investigated. The results show that TiB 2 particles are homogeneous and distribute uniformly, and the TiB 2-Cu interfaces are clean and free-from interfacial reaction products and amorphous layers, the densifications of the TiB 2p/Cu composites are higher than 98.2%. The mean linear coefficients of thermal expansion at 20–100 °C for TiB 2p/Cu composites range from 8.3×10 −6 to 10.8×10 −6/K and decrease with increasing volume fraction of TiB 2. The experimental coefficients of thermal expansion agree well with the predicted values based on Turner's model. The thermal conductivities of TiB 2p/Cu composites range from 167.3 to 215.4 W/(m·K), decreasing with increasing volume fraction TiB 2.