The thermal and electric conduction properties of high dense TiB2P/Cu composites fabricated by squeeze casting technology

Abstract

For electronic packaging applications, TiB 2 /Cu composites with volume fractions of 50%, 58%, 65% TiB 2 content have been fabricated by the patented squeeze-casting technology. The microstructures and thermal and electric conduction properties of the TiB 2 /Cu composites are investigated. The results show that TiB 2 particles are homogeneous and uniformly, and the TiB 2 -Cu interfaces are clean and free-from interfacial reaction products and amorphous layers; The densifications of the TiB 2 /Cu composites are higher than 98.2%. The thermal conductivities of TiB 2P /Cu composites range from 167.3 to 215.4 W/m °C and decrease with an increase in volume fraction of TiB 2 content. The thermal conductivities agree well with predicted values of theoretical models. The electric conductivities of TiB 2 /Cu composites are between 33.7–43.9 %IACS and decreased with the increasing of TiB2 content. The achievement of higher thermal and electric conduction is attributed to the full densities and high purity TiB 2 /Cu composites, which are attained through the cost-effective squeeze-casting technology processes.