Abstract
The implementation of mainstream passive low-pass filters (LPFs) remains a challenge to satisfy the requirements of small size and compatibility with standard CMOS process. Fortunately, the emerging technology of through-silicon via (TSV) offers a possible solution to this issue by developing 3D LPF architecture. A 3D LPF based on coaxial TSV is exploited by fabrication and measurement. The measurement result shows good agreement with that obtained by finite element method.
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