Fabrication and Characterization of Thermoplastic Elastomer Dry Adhesives with High Strength and Low Contamination

Abstract

Polydimethylsiloxane (PDMS) and polyurethane elastomers have commonly been used to manufacture mushroom shaped gecko-inspired dry adhesives with high normal adhesion strength. However, the thermosetting nature of these two materials severely limits the commercial viability of their manufacturing due to long curing times and high material costs. In this work, we introduce poly(styrene-ethylene/butylene-styrene) (SEBS) thermoplastic elastomers as an alternative for the manufacture of mushroom shaped dry adhesives with both directional and nondirectional performance. These materials are attractive for their potential to be less contaminating via oligomer transfer than thermoset elastomers, as well as being more suited to mass manufacturing. Low material transfer properties are attractive for adhesives that could potentially be used in cleanroom environments for microscale assembly and handling in which device contamination is a serious concern. We characterized a thermoplastic elastomer in terms of oligomer transfer using X-ray photoelectron spectroscopy and found that the SEBS transfers negligible amounts of its own oligomers, during contact with a gold-coated silicon surface, which may be representative of the metallic bond pads found in micro-electro-mechanical systems devices. We also demonstrate the fabrication of mushroom shaped isotropic and anisotropic adhesive fibers with two different SEBS elastomer grades using thermocompression molding and characterize the adhesives in terms of their shear-enhanced normal adhesion strength. The overall adhesion of one of the thermoplastic elastomer adhesives was found to be stronger or comparable to their polyurethane counterparts with identical dimensions.