Abstract
Liquid crystal polymer (LCP) composites filled with sepiolite and glass microcapsules were prepared by melt compounding. The composites were extruded using a twin-screw extruder and injection-molded. The objective of this study is to check a possibility of producing a polymeric composite with a low dielectric constant. Physical characteristics of the composites, such as morphological, rheological, mechanical, and electrical properties were analyzed. In particular, the glass microcapsule-reinforced LCP composites showed a significant improvement in lowering the dielectric constant due to its high air content. Additionally, sepiolite could act as an effective filler to improve the mechanical properties of the composites.
Highlights
Liquid Crystal Polymer Composites.The fifth generation (5G) era in telecommunication is demanding a technological revolution that brings new changes to our lives
As the content of the glass microcapsules increased, this trend became stronger. This indicates that the glass microcapsules were well-dispersed in the composite and that the interaction between the glass microcapsules and the Liquid crystal polymer (LCP) matrix was strong
We investigated the LCP composites filled with sepiolite and glass microcapsules
Summary
Liquid Crystal Polymer Composites.The fifth generation (5G) era in telecommunication is demanding a technological revolution that brings new changes to our lives. Liquid crystal polymer (LCP) has a relatively low viscosity due to its unique molecular structure, and it can be melt-processed with the help of conventional manufacturing methods [7,8,9]. It shows excellent physical properties such as high mechanical strength, low molding shrinkage, high impact strength from low to high temperature, and excellent heat resistance [10,11,12]. It is mainly used for electronic parts such as micro-connectors and integrated circuit (IC)
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