Abstract
We report on an extremely bendable moisture barrier for the thin-film encapsulation of organic light-emitting diodes (OLEDs). Hybrid barriers with various dyads of alternating aluminum oxide (Al2O3) and plasma-polymerized layers, which are utilizable for the thin-film encapsulation of flexible OLEDs, were prepared by atomic layer deposition and plasma chemical vapor deposition, respectively. When the total thickness of Al2O3 was fixed at 20 nm, an ultimate 200-dyad multilayer barrier showed change of less than 20% in water vapor transmission rate from its initial value of the order of 10−4 g/m2/day, even after 10 000 times of bending with a bending radius of 5 mm.
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