Abstract
This project deals with the experimental results of leaching of Sn from solder dross by means of leaching using different concentration of hydrochloric acid (HCl). Solder dross was sieved to obtain a mean particle size of 75 μm. The solder dross powder obtained was leached by using HCl acid aqueous solution. To optimize the parameter required for recovery of Sn from solder dross, initially the bench scale studies were carried out using varying acid concentration, stirring time and temperature. The experimental indicate that 98.7% of Sn was leached out from solder dross using 0.1M of HCl, 24 hours of stirring time at60°C solution temperature.
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