Abstract
Abstract We examine the influence of external circuit parameters on the breakdown of radio-frequency capacitively coupled plasma (RF-CCP) at pressures of 1 Torr and 10 Torr using a fluid-external circuit coupled model. At 1 Torr, best impedance matching delays the breakdown time, suggesting that non-best matching may expedite initiation. At 10 Torr, breakdown time decreases slightly under best matching, indicating minimal effect at higher pressures. Higher pressure divides the breakdown onset phase into two stages: an initial decrease in electron density with rising energy, followed by exponential density growth with oscillatory energy increases. Using best matching parameters enhances steady-state electron density and electron heating at both pressures. These findings highlight the significant role of external circuit parameters in the breakdown process and offer insights for optimizing plasma-enhanced chemical vapor deposition (PECVD) processes.
Published Version
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