Extending Moore’s Law with Integrated Photonics (and Packaging)

Abstract

The insatiable growth in computing needs, coupled with the end of Denard Scaling and the slowdown of Moore’s Law, is resulting in a major shift across the industry towards a chiplets-based product architecture. Solutions that enable the heterogeneous integration of disaggregated silicon at high data rates and low power are becoming increasingly important. Silicon photonics based interconnect solutions play a critical role in enabling this integration.