Abstract
This article outlines a number of inkjet-/threedimensional (3-D)-printed prototypes of RF and millimeter-wave (mmW) components, interconnects, and systems. We pay special attention to the major challenges related to applying current multidimensional printing technologies to the fabrication of flexible multichip modules (MCMs) and high-performance mmW components.
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Published version (
Free)
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
