Abstract

Gate sidewall spacers, a pathway to the fringing fields, play a crucial role in the device design. In this article, using well-calibrated TCAD models, we have explored the impact of a sidewall ferroelectric (FE) spacer on a negative capacitance (NC) FinFET. In the proposed study, the FE layer is present beneath the gate electrode and at the spacer region that operates in the NC region. Through three novel FE–dielectric (FE–DE) spacer configurations, we found that proficient electrostatic control can be attained with the optimized stacked placement of the spacers. The fringing fields alter the FE polarization present at the spacer stack and modulates the channel charge, which is a prime objective of this work. Furthermore, we have varied the FE parameters, drain doping, and extension length to optimize the proposed FE–DE spacer configurations. We have done mixed-mode simulations to design an inverter and a three-stage ring oscillator to emphasize our results. The optimized spacer configuration shows~3.9% overshoot due to higher gate capacitance ( <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${C}_{GG}$ </tex-math></inline-formula> ); however, the <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$I_{\mathrm{ON}} / I_{\mathrm{OFF}}$ </tex-math></inline-formula> ratio is approximately twic than that of the baseline counterpart. The results reveal that the optimized spacer configuration also mitigates the negative differential resistance (NDR), which allows the NC-based devices to be an efficient candidate for analog applications.

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