Abstract
Microwave field near-field radiation imaging technology is widely used in the failure analysis of chips, but due to the low resolution, it is hard to obtain the field distributions of miniaturized and precision devices. In this article, we built two testing systems based on the method of electromagnetic induction and diamond color-center, respectively. The traditional system uses a multilayer PCB microstrip, while the novel system uses nanoscale high-sensitivity sensing of color centers in the design of resonant microwave field probes with near-field measurement sensitivity to enable nanoscale high-sensitivity measurements of different physical quantities. We tested two devices in this article, and the results show that compared with traditional measurement method, the novel method promotes higher resolution (submicron level), higher sensitivity, and nondestructive imaging. This method can accurately characterize the near-field distribution of microwave integrated circuit chips, such as spiral antennas, and amplifiers. Especially in the amplifier chip, the signal change trend of the amplifier circuit can be clearly characterized. It is expected to provide a new measurement concept in real word applications, such as chip electromagnetic compatibility, microwave chip failure analysis, and antenna near-field scanning radiation emission testing.
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