Abstract

Based on the self-dressing of ice fixed abrasive polishing (IFAP) by melting, a new method of subzero polishing was proposed in this paper as multi-layer ice fixed abrasive polishing (MIFAP). The multi-layer ice fixed abrasive polishing tool (MIFAPT) was designed as triple-layer and used to polishing single-crystal germanium (sc-Ge) wafer through “rough polishing—semi-fine polishing—fine polishing” (RP-SP-FP) by one time of clamping in subzero. The results show that the surface roughness Sa of sc-Ge wafer polished by MIFAPT is at the nanoscale as the same as by single-layer ice fixed abrasive polishing tool (SIFAPT). Compared with SIFAP, the machining efficient of MIFAP is increased by about 66.7 %.

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