Abstract
A unique boiling heat transfer study of wetting fluids in a vertical three-dimensional rectangle microchannel was carried out in this paper, to develop a novel passive three-dimensional chip stack cooling technology. The base liquids were deionized water and R113, and Sodium dodecagon sulfate (SDS) was used as a surfactant, which is added into the base fluids for developing wetting fluids. The length, gap, and width of rectangle channels were in the range of 30 mm to 100 mm,30 mm to 50 mm, and 0.4 mm to 4 mm, respectively. Metal wires with different numbers were laid in the rectangle channel along the flow direction for forming change in the width of the microchannel. The study results show that using wetting fluids can significantly enhance both heat transfer coefficients and maximum heat flux of thermosyphon boiling in three-dimensional microchannels compared with that found in pure liquids. The enhanced effects have significant relations with the three-dimensional geometric dimensions. The present experimental results provide significant technology support for passive three-dimensional chip cooling.
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