Experimental Study of Alumina Particle Removal From a Plane surface

Abstract

Micron and submicron alumina particles are often used for the mechanical polishing of the GaAs wafers processed in the microelectronic industry. A better understanding of the adhesion mechanisms is the key factor for the particle removal and for the optimisation of the industrial chemical cleaning. However, the nature and the strength of the complex interactions occurring between asymmetrical alumina particles and the surface remain unclear. Thus, an experimental study of the detachment of asymmetrical alumina particles in adhesive contact with a glass plate was done using a specially designed shear stress flow chamber. A series of experiments was performed to measure the shear stress necessary to remove individual alumina particles (of 3 and 0.3 µm nominal size) under various chemical solutions (diluted ammonia, surfactant and glycerol). Then the effects of the particle size, the resting time, the pH and the nature of the chemical solutions used for the removal of the alumina particles was characterised in terms of percentage of alumina particles detached. Results have shown that the longer the resting time, the more adherent the particles are. Moreover, it was found that the ammonia solution gives the best particle removal rate (80%) because of the strong repulsive electrostatic interactions between the alumina particles and the glass surface, both being charged negatively in a basic solution.