Abstract
The experimental setup shall compare face grinding with lateral grinding in a single processing step using fused silica and BK7 as materials. Resin and metal bonded tools are used in face and lateral grinding strategies. The paper presents the results in order to deepen the knowledge about those grinding technologies and to further improve the properties of fabricated components. Furthermore, the results confirm, that ultra-fine grinding is a technology, which can be used to process inorganic non-metallic materials with high quality surfaces with a low roughness and high flatness in a low processing time.
Highlights
The experimental setup shall compare face grinding with lateral grinding in a single processing step using fused silica and BK7 as materials
Two diamond tools with different bonds are used to compare face grinding with lateral grinding in a single processing step
The depth of cut is varied in three steps to gain knowledge about the influence of removal volume in regards to the cutting width, while regarding the special step like sample geometry
Summary
A 5-axis CNC machine from company SAUER (DMG) with integrated ultrasonic assistance was used to conduct the experiments on both materials, fused silica as well as BK7. The experimental setup with an optimized sample geometry was already described in a previous paper of last year’s EOSAM.[1] Two diamond tools with different bonds are used to compare face grinding with lateral grinding in a single processing step. The compared sample areas are either face grinded/lateral grinded only or processed with both technologies combined. The stated number in mm represents the infeed of one lane, the number stated in μm represents the cutting depth for the last lane, where the tool is in contact with the material again for face grinding. The examined parameters are the roughness and waviness These parameters are distinguished by their direction of measurement according to the direction of the feed rate (parallel, vertical) and the position of the measurement (single/combined processing and horizontal/vertical surface)
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