Experimental research on the thermal performance of the dry conduction plate for multi-point electronic chips

Abstract

This paper designs a dry conductive heat dissipation method using several parallel heat pipes to solve the difficulty of the thermal management problem of multi-point electronic chips. The heat sources are distributed along the heat pipe, whose heat is efficiently conducted from the middle to the cold plate on the two sides. The effect of gravity, flow rate, and heat source distributions on the heat transfer performance is studied. The testing data indicated that gravity has less effect on the conduction performance of heat pipes for the cooling on two sides. As the heat sources concentrate in the centre, the heat pipe temperature difference between the centre and the side increases under the same transmission power. The results demonstrated that the two-side cooling and multi-point distribution heat conduction method is conducive to improving the thermal management capability under different inclination angles.