Abstract

Deep-and-narrow micro-grooves are the common functional structures of miniature parts. The fabrication of the micromilled grooves with high quality and accuracy is the essential guarantee of the causative performance for these miniature parts, and micromilling is the most versatile process to machine such micro-grooves. However, micromilling technology is a highly tool-dependent process, and the commercial carbide micromilling cutter has shown obvious deficiencies in terms of rapid tool wear and inferior machined quality during the machining process. In this paper, a polycrystalline diamond (PCD) micromilling cutter with a large-aspect-ratio (LAR) was designed and prepared by the self-proposed hybrid fabrication method of laser and precision grinding. Micromilling experiments on oxygen-free copper were conducted, and the carbide micromilling cutter was selected in the comparative experiments. The variations of milling forces and specific energy were analyzed through the parameter experiments. Then, the surface quality, machined accuracy and tool wear were further investigated. Results showed that the PCD micromilling cutter with an aspect ratio of 3.25 was successfully manufactured by the proposed hybrid method. The self-fabricated PCD micromilling cutter presented remarkable superiority in terms of the surface quality, machined accuracy, and tool wear when preparing deep-and-narrow micro-grooves. Finally, a satisfactory micromilled groove with an aspect ratio of 2.5 was achieved with the self-fabricated LAR PCD cutter under the optimized conditions.

Highlights

  • In recent years, the requirement for and application of microdevices with complex structures have been rapidly increasing in the national defense and civil fields

  • It should be noted that the force Fx, Fy, and Fz represented the terminology of the feed force (Ff ), the cross feed force (Fp ), and the main force (Fc ), respectively

  • A large-aspect-ratio polycrystalline diamond (PCD) cutter was fabricated by the developed hybrid method of laser and grinding

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Summary

Introduction

The requirement for and application of microdevices with complex structures have been rapidly increasing in the national defense and civil fields. The deepand-narrow microgrooved structure has become a research hotspot in mechanical field because it can reduce workpiece weight and material consumption under the premise of ensuring its stiffness and strength. Deep-and-narrow micro-groove is a critical functional structure of the Terahertz (THz) slow-wave structure [1,2], microforming die and micro-heat exchanger [3], etc. The common characteristics of these structures are [4,5]: (1) material diversity (including metal, ceramics, and composite materials); (2) complex geometric structure with large-aspect-ratio and small scale; (3) high machined quality and consistency; and (4) strict machining accuracy and high sidewall perpendicularity, etc. The alternative processing technologies for the deep-and-narrow microgrooved structures primarily include electromachining technology (EDM and ECM), LIGA/UV-LIGA, grinding, micromilling, etc. Micromilling is one of the most reliable micromanufacturing methods for these micro-grooved structures, because

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