Abstract

Diamond wire sawing is widely used in processing NdFeB rare earth permanent magnets. However, it induces periodic saw marks and fracture chipping pits, which severely affect the flatness and surface quality of the products. In this study, the lateral motion of the diamond wire was monitored to determine the surface formation mechanism. Then, a white light interferometer and an SEM were used to observe the sawed surface profile. Finally, the surface quality was quantitatively studied by identifying the area rate of fracture chipping pits with an image recognition MATLAB script. According to the observation results, the calculation formula of PV which is related to the process parameters was deduced. Additionally, by combining the fracture rate and wire vibration, a novel method was proposed to investigate the optimal process parameters. It can be found that the surface quality sawed at P = 0.21 MPa, vf = 0.2 mm/min, and vs = 1.8 m/s remains better than when sawed at P = 0.15 MPa, vf = 0.1 mm/min, and vs = 1.8 m/s, which means the sawing efficiency can be doubled under such circumstances, i.e., when the surface quality remains the same.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call