Abstract

In this paper, ultraviolet (UV)-induced nanoparticle colloid jet machining is proposed to achieve ultrasmooth surface polishing by using the interaction between nanoparticles and the workpiece surface under the action of the ultraviolet field and the hydrodynamic pressure field. In the process of UV-induced nanoparticle colloid jet machining, the effects of photocatalysis on the interaction between nanoparticles and the workpiece surface need to be further studied in order to better understand the polishing process. This paper presents the interaction between TiO2 nanoparticles and a Si workpiece surface with and without ultraviolet irradiation. Scanning electron microscopy (SEM), Fourier-transform infrared spectroscopy (FT-IR), and X-ray photoelectron spectroscopy (XPS) were applied to investigate the differences in the interaction of TiO2 nanoparticles with Si workpieces. The SEM and XPS results indicate that the photocatalysis of UV light can promote the interaction between TiO2 nanoparticles and a Si surface by creating more interfacial reaction active centers between the TiO2 nanoparticles and the Si workpiece. The FT-IR and XPS spectra show that TiO2 nanoparticles are chemically bonded to the Si workpiece by oxygen-bridging atoms in Ti-O-Si bonds. Due to the effects of photocatalysis, UV-induced nanoparticle colloid jet machining has a higher polishing efficiency than nanoparticle colloid jet machining with the same polishing parameters.

Highlights

  • At present, a variety of surface processing technologies and methods have been developed to meet the urgent needs in optics, electronic science, and other fields related to the creation of ultrasmooth surfaces with high precision, surface figure accuracy, and extremely low surface roughness [1,2]

  • The Scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS) results indicate that the photocatalysis of UV light can promote the interaction between TiO2 nanoparticles and a Si surface by creating more interfacial reaction active centers between the TiO2 nanoparticles and the Si workpiece

  • A variety of surface processing technologies and methods have been developed to meet the urgent needs in optics, electronic science, and other fields related to the creation of ultrasmooth surfaces with high precision, surface figure accuracy, and extremely low surface roughness [1,2]

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Summary

Introduction

A variety of surface processing technologies and methods have been developed to meet the urgent needs in optics, electronic science, and other fields related to the creation of ultrasmooth surfaces with high precision, surface figure accuracy, and extremely low surface roughness [1,2]. The average maximum p-v value (Sz) of the Si workpiece polished by nanoparticle colloid jet machining is 59.2 nm, and the average surface roughness is decreased to Sq 7.575 nm (Sa 6.025 nm). The surface morphology results of the Si workpiece after polishing by UV-induced nanoparticle colloid jet machining show that most of the microsurface peaks and pits were removed away from the workpiece. Under the same conditions of 120 min polishing, the surface roughness of the UV-induced nanoparticle colloid jet machining is lower, and the workpiece surface is flatter and more uniform

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