Abstract

To further investigate the Mode I crack growth and damage mechanism, compression tests were performed on notched semi-circular bending (NSCB) specimens at different cycle amplitudes. The crack propagation gauge and digital image correlation (DIC) recorded the entire process of crack growth. The real-time crack growth rate and evolution of the horizontal strain field during crack growth were obtained. Based on the crack growth rate, the crack growth process can be divided into three stages: the cracking latent period (primary stage), stable crack growth stage (secondary stage), and accelerated crack growth stage (tertiary stage). The cracking latent period accounts for a large proportion of the entire crack growth. The stable crack (i.e., steady subcritical crack growth) expanded slowly to a certain extent after initiation, and then the accelerated crack growth led to failure. With the increase in the cyclic amplitude, the cracking latent period is shortened and the crack growth rate is accelerated. The crack growth rate is positively correlated with the stress intensity factor. Moreover, scanning electron microscopy (SEM) was used to analyse the development of the fracture process zone (FPZ) and the subcritical crack damage mechanism. The SEM images showed two damage phenomena: (1) intergranular cracks caused by grain debonding (primary mechanism) and (2) transgranular cracks (secondary mechanism).

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