Abstract
Nowadays diamond wire sawing is used as the most efficient method for manufacturing of silicon wafers. However, experimental investigation of diamond wire and abrasive wear has process based limitations and is expensive when conducted on a wire saw. Due to high material consumption, it is difficult to identify and observe individual grains. In this study, a novel experimental setup is proposed for rapid wear testing of diamond wires, which can emulate realistic grain-workpiece contact conditions considering the undeformed chip thickness and long contact lengths. Moreover, the setup allows monitoring the wear propagation of identical abrasive grains throughout lifetime. The experimental results are validated through investigations on wires used on a multi-wire saw. Wire topography is analyzed applying a proprietary software application to characterize grain wear in terms of change in the abrasive grain protrusion, base area and volume. The influence of wire wear on cutting forces and normal forces is discussed.
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