Experimental investigation of thermal conductivity during aging of nanoporous sintered silver

Abstract

Silver (Ag) paste sintering is used as a die-bonding technology for the next generation of power electronic modules as Ag offers a high melting temperature as well as excellent thermal and electrical conductivities. Ag paste sintering is performed using specific conditions depending on the type of paste and the users’ specifications (temperature, time, pressure), ending up in a porous joint. As a result, the properties of those joints are heavily influenced by their densities (i.e. porosity). Despite the numerous studies reported in the literature, the relationship between the density of the joint and its thermal conductivity remains an issue since access to the density of an embedded thin joint is very challenging. Furthermore, little is known on the evolution of the thermal conductivity in operating conditions. In this study, these issues were investigated by developing self-standing specimens with microstructures representative of those of real joints. In order to study a wide range of porosity, sintering was performed using a single time/temperature under various pressures. The thermal conductivity was measured using 3D flash method, consisting in applying a short non-uniform laser excitation on the surface of the sample, leading to three-dimensional heat transfer. The relationship between porosity and thermal conductivity is established for the as-sintered state and after aging up to 500 h at temperatures ranging from 150 °C to 350 °C and is compared to existing models. The evolution of the thermal properties during thermal aging is discussed considering both the elaboration conditions and the microstructure evolution.