Experimental Investigation of Heat Transfer from Symmetric and Asymmetric IC Chips Mounted on the SMPS Board with and without PCM

Abstract

In the present study the experiments were conducted on steady-state that incorporated nine symmetric and asymmetric separate discrete integrated circuits (ICs), strategically positioned at different locations on a substrate board, both with and without phase-change material (PCM). These ICs were subjected to varying levels of heat flux. It has been noted that the temperature is highly influenced by variables such as the size and positions of integrated circuits (ICs), the heat flux applied to the ICs. Furthermore, the non-dimensional geometric distance parameter, λ, is notably affected by both the size and positioning of the ICs. It's observed that at a higher value of λ (0.19), the temperature decreases by 18.79% at a velocity of 3 m/s and by 26.48% at a velocity of 5 m/s without PCM. With PCM, the temperature drop is 23.58% at 3 m/s and 32.47% at 5 m/s. The correlation shows a regression of 0.97 and an RMS error of 0.012%. A proposed correlation establishes a connection between θ (non-dimensional temperature) and λ, suggesting that the maximum non-dimensional temperature (θ) decreases with an increase in λ. This implies that the maximum temperature of the integrated circuits (ICs) is reduced at higher λ values. These findings provide valuable insights for thermal design engineers, aiding them in optimizing the placement of integrated circuits (ICs) to improve the reliability and lifespan of the ICs.