Abstract
In this research, two vapor chambers with the same dimensions were manufactured to control the temperature of the high-power printed circuit board (PCB). In one case, the evaporator and condenser were rough and superhydrophobic, respectively. Another vapor chamber was nonrough and nonsuperhydrophobic (simple). In this study, as new experimental work, the exergy destruction analysis was performed in simple and rough-superhydrophobic vapor chambers and the effect of different parameters on exergy destruction in both vapor chambers was investigated and compared. Also, the effect of different parameters on the thermal resistance of the vapor chamber, taking into account the roughness and superhydrophobicity of the vapor chamber, was investigated and compared with the thermal resistance of the simple vapor chamber. The results showed that roughened evaporator and superhydrophobic condenser affected the amount of influence of other parameters on the thermal resistance and exergy destruction, improved the efficiency of the vapor chamber in most test cases, and reduced exergy destruction. According to the tested cases, the minimum thermal resistance and the exergy destruction were obtained as 0.18 °C/W and 13.32 W, respectively. Also, exergy destruction analysis showed that the amount of exergy destruction depended on the studied parameters in this study.
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