Abstract
Abstract With the excellent thermal conductivity and the compatibility to micro electromechanical systems technology, silicon is widely used in micro heat pipes (MHPs). Copper shows higher heat transfer capability and capillary traction than silicon. Copper microgrooves were fabricated on the silicon wafer using electroforming technique in this paper. Water contact angle measurements and thermal behavior tests demonstrated that copper-grooved MHPs showed better performance than silicon ones. Under the input power of 5.99 W, the equivalent thermal conductivities of copper-grooved and silicon-grooved MHPs were 228.98 W/K · m and 196.26 W/K · m. This work showed the feasibility of copper grooved silicon based MHPs in heat transfer for high-power light emitting diode (HP LED).
Highlights
In recent years, how to reduce the high-power light emitting diode’s (HP LED) thermal resistance, junction temperature and hot spot influence have been studied by different research groups in passive and active cooling mechanism
The water-filled micro heat pipes (MHPs) had a thermal conductivity of approximately 290 W/m · K while the Hg-filled MHP had a thermal conductivity of approximately 790 W/ m · K
It is obvious that the equivalent thermal conductivity of MHPs is higher than that of the silicon wafer
Summary
How to reduce the high-power light emitting diode’s (HP LED) thermal resistance, junction temperature and hot spot influence have been studied by different research groups in passive and active cooling mechanism. The best-known devices for effective heat transfer or heat spreading with the lowest thermal resistance are heat pipes with vapor chambers which are two-phase heat transfer devices with excellent heat spreading and heat transfer characteristics [15,16]. Ye H [17] fabricated a fluid channel by wet etching and wafer bonding with silicon and glass. A MHP consisted of two layers was introduced by Liu X. Glass was the up layer, which served as a chamber connecting the vapor phase of all the grooves. For 5 W input power, when the filling ratio was 35%, long MHP had the lowest evaporator surface temperature of 90°C. For the short one, the lowest evaporator surface temperature was 86°C at the optimal filling ratio. The working temperature range of MHP was 37.3°C −44.1°C
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