Experimental investigation and analysis of EMI in stacked I/O connectors of PCB

Abstract

The electromagnetic interference (EMI) caused by the noise resulting from a common mode of stacked I/O connectors is analyzed using both numerical simulation and experimental measurements. The use of stacked connectors exists on the PCBs of today’s information technology equipment in order to reduce size; however, size reductions will cause increased severe EMI. After diagnosis and analysis, a strategy is presented to suppress the EMI noise level, as well as its emissions, and is found to be very effective as shown by our experiments.