Abstract
This paper presented the investigations of the electromagnetic interferences (EMI) caused by the noises resulted from a common mode of stacked I/O connectors, which are analyzed using both numerical simulations and experimental measurements. The structures of stacked I/O connectors popularly exist on the printed circuit board (PCB) of today's information technology equipments (ITE) for the purpose of reducing the sizes of equipments, from where it is observed that more size reduction will cause severer EMI. After the diagnosis and analysis, a strategy is presented to suppress the noise level as well as its emission, which is found to be very effective as shown in our examinations.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
