Abstract
The Oh-Park methodology was proposed to overcome the limitations of Steinberg’s theory for evaluating the structural safety of space-borne electronics and has been experimentally verified at the printed circuit board (PCB) specimen level for various types of electronic packages, such as ball grid arrays (BGAs), column grid arrays (CGAs), and small-outline packages (SOPs). However, it is necessary to validate the design methodology because the PCB mounted on the housing is affected by the elastic mode of the mechanical housing. In addition, although the validity of the existing theory based on critical strain has been verified for horizontally mounted structures, there are cases where PCBs are mounted vertically. Therefore, it is essential to consider the dynamic influence of the boundary conditions of mounted electronics. In this study, electronics specimens with corresponding boundary conditions were fabricated, and a fatigue-life test was performed. In addition, a structural analysis using Steinberg’s theory and the Oh-Park methodology was performed, and the results were compared with those of the fatigue-life test. The results showed that the analysis using the Oh-Park methodology accurately represented the test results, and the validity of the Oh-Park methodology for vertical electronics was verified experimentally.
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