Abstract
A common architecture for piezoelectric MEMS sensors and actuators is a thin piezoelectric film patterned atop a much thicker passive bending structure (e.g., a silicon beam or plate). In a first common configuration, parallel plate electrodes reside above and below the piezoelectric film to realize a 3-1 mode device. In a second configuration, a top electrode is patterned in the form of an interdigitated transducer (IDT) to realize a parallel network of 3-3 mode cells. A theoretical comparison of figures-of-merit for each configuration has been presented by research teams in the past. Figures-of-merit include coupling coefficient, actuator strength, and signal to noise ratio for sensing applications. Less work has been performed directly comparing these configurations experimentally using micro-processed thin films. In this presentation, a micromachined accelerometer structure employing a set of multiple springs is used to experimentally compare the two configurations. Each silicon spring contains a 1micron thick lead zicronate titanate (PZT) film along the top surface. Aside from electrode type, the springs are identical in dimension—providing an opportunity for direct comparison.
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