Experimental and Simulation Study of Nanometric Cutting of Silicon by Diamond Turning

Abstract

Diamond turning is an ultra-precision manufacturing method which is employed to fabricate components requiring submicron geometric accuracy and atomically smooth surface finish, such as those utilized in the x-ray optics, IR optics and semiconductors industries. This study represents the experimental investigation as well as MD Simulation to elucidate the strong dependence of cutting parameters (tool feed rate, depth of cut and spindle speed) in influencing the ductile-regime machining conditions during cutting of silicon. Precitech Nanoform 200 diamond turning machine is used to perform experiments on 50 mm diameter (111) oriented silicon wafers. To enhance the understanding of actual cutting mechanism, Molecular Dynamic Simulation is being incorporated to mimic the nanometric cutting of silicon. The simulation study encompasses the investigation of phase transformation, cutting force, thrust force and temperature exerted at the cutting zone. The actual cutting mechanism involved during the nanometric cutting of silicon is clearly visualized from MD simulation.