Abstract
To assess the lifetime of leadfree solder joints, it is necessary to investigate their creep and failure behavior under cyclic thermo-mechanical loading. In connection with finite element analyses the use of an appropriate material model is necessary. The following paper reports on the implementation of a specific version of the viscoplastic constitutive model of Chaboche in the FEM-code ABAQUS, the experimental program for the identification of the material parameters of a Sn–Ag–Cu solder and a comparison of some numerical and experimental results.
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