Expandable Polymer Enabled Wirelessly Destructible High‐Performance Solid State Electronics

Abstract

In today's digital age, the increasing dependence on information also makes us vulnerable to potential invasion of privacy and cyber security. Consider a scenario in which a hard drive is stolen, lost, or misplaced, which contains secured and valuable information. In such a case, it is important to have the ability to remotely destroy the sensitive part of the device (e.g., memory or processor) if it is not possible to regain it. Many emerging materials and even some traditional materials like silicon, aluminum, zinc oxide, tungsten, and magnesium, which are often used for logic processor and memory, show promise to be gradually dissolved upon exposure of various liquid medium. However, often these wet processes are too slow, fully destructive, and require assistance from the liquid materials and their suitable availability at the time of need. This study shows Joule heating effect induced thermal expansion and stress gradient between thermally expandable advanced polymeric material and flexible bulk monocrystalline silicon (100) to destroy high‐performance solid state electronics as needed and under 10 s. This study also shows different stimuli‐assisted smartphone‐operated remote destructions of such complementary metal oxide semiconductor electronics.