Abstract
It is reported that thin films of polyimide are efficiently etched in air at pulsed excimer laser wavelengths of 248, 308, and 351 nm. Etch rate versus incident fluence data are found to obey a Beer–Lambert etching relation. Sharp laser fluence thresholds for significant etching are found to correlate with the wavelength-dependent absorption coefficient. The absorbed energy density required to initiate significant etching is found, within experimental error, to be independent of the wavelengths examined. It is felt that this information demonstrates the predominantly thermal nature of the laser etching mechanism. Additionally, infrared spectroscopy and coupled gas chromatography/mass spectroscopy were used to identify several gases evolved during pulsed laser etching of polyimide in both air and vacuum.
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