Abstract
A highly effective method of machining ceramic has been newly developed using a krypton fluoride (KrF) excimer laser with a 248 nm wavelength. The laser was irradiated on SiC in water to form a soft hydrous oxide layer by photochemical reaction. The softened layer was then cut with a diamond tool to form a mirror surface finish. The optimum conditions were found for both high machining rate and better surface integrity of SiC.
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