Evaluation of the Stress Distribution by the Stepped Load Indentation Test with Constant Depth

Abstract

For accurate evaluation of the reliability of electronic package, FEM analyses considering the creep deformation of solder joint in-situ should be conducted. It is well known that the indentation creep test has an advantage to evaluate the creep deformation in microscopic region although there are the problems. Authors already modified the indentation creep test and proposed the method to estimate the steady state creep deformation by the modified test. For lead free solders generally used for the solder joint, the transient creep deformation should be measured by the indentation test in addition to the steady state creep deformation. The transient creep strain occurs in the indentation process. Therefore, it needs to separate the strain into the elastic-plastic strain and the creep strain. In this paper, the method to obtain the stress-strain relation using the indentation test is proposed. New indentation test used the stepped load was proposed to obtained the stress variation during the indenter was pushed and conducted by the numerical test. The suitable measurement point to obtain the relationship between the stress and the strain was identified. The stress variation estimated by proposed area well coincides with the equivalent stress variation of the nodal solution. Therefore, if the method to obtain the strain variation during the indentation process by the indentation in future is developped, it may be possible to estimate the stress-strain curve expressed the uniaxial deformation in the microscopic region.