Evaluation of Residual Stress in Nano-TiO<sub>2</sub> Film on ITO Glass by Synchrotron X-Ray Diffraction

Abstract

In this study, evaluation of residual stress in nano-TiO2 film on ITO glass is carried out. The films with thickness less than 30 nm are prepared by the dual-arcs magnetron sputtering with gas pressure 10 and 20 Pa. The surface microstructure and grain morphology of the nano-TiO2 films are observed by the atomic force microscopy (AFM). In order to accurately evaluate the residual stress in the film, the Young’s modulus of the film is determined by the nanoindentation with three point bending method at first, then the internal residual stress in the film is measured by high energy X-ray diffraction with the synchrotron radiation facility Spring-8. The measured residual stresses of nano-TiO2 films prepared with gas pressure 10 and 20 Pa are -11.6 and -9.1 GPa, respectively. It is shown that the residual stress of TiO2 films decrease with the increasing of gas pressure.