Abstract
The conventional exposed pad low-profile quad flat pack (E-pad LQFP) package is a low cost solution for multimedia chips, but its disadvantages are limited pin count and worse electrical characteristics. In order to increase their pin utilization rate and electrical characteristics for high-speed applications, an innovative leadframe package, named multiple exposed pads (M-pad) LQFP package, is proposed. By bonding all power and ground wires to their dedicated exposed pads, the leads originally bonded to the corresponding power and ground wires can be used as the spared leads for the other signals, or they can be just removed to reduce the lead numbers, and thus the size and cost of the M-pad leadframe package. The M-pad LQFP package was evaluated for manufacturing processes and electrical characteristics. The parasitics of power nets and S-parameters of high-speed differential signals were extracted using 3D electromagnetic field solvers. The simulated power parasitics of M-pad LQFP are much lower than those of E-pad LQFP and BGA packages. The simulated differential S-parameters of M-pad LQFP also indicate less signal loss compared with those of E-pad LQFP. The co-simulation of chip-(M-pad) package-board with multi-Gbps serial link was performed with well-behaved eye-diagrams that conform to high-definition multimedia interface (HDMI) specification.
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