Evaluation of Interfacial Thermal Resistance of Al-Si Alloy by Using Image-Based Simulation

Abstract

Interfacial thermal resistances of Al-Si alloys were evaluated by comparing the measured thermal conductivities and the simulated thermal conductivities. Al-7%Si, Al-18%Si and Al-18%Si held in the solid-liquid coexistence temperature for 90 minutes were fabricated by gravity casting. Thermal conductivities were measured with the steady state thermal conductivity measuring device. Thermal conductivities were also simulated by using optical microscope images. Comparing the measured thermal conductivities and the simulated thermal conductivities, interfacial thermal resistances in Al-Si interfaces were evaluated as about 2.5-4.8×10-9 m2K/W.