Evaluation of Crack Suppression Effect of TiNi SMA Foil Embedded in CFRP Cross-Ply Laminates with Embedded Small-Diameter FBG Sensor

Abstract

A Ti-Ni shape memory alloy (SMA) foil and a small-diameter fiber Bragg grating (FBG) sensor were embedded simultaneously into a CFRP cross-ply laminate. When the specimen was heated, the recovery compressive force was generated from the embedded SMA foil, which homogenized the non-uniform strain distribution caused by cracks in the 90° ply. Then, the tensile stress in the 90° ply was relaxed and the occurrence of new transverse cracks was suppressed. This effect was evaluated with the embedded FBG sensor. When the specimen was heated, the deformed reflection spectrum of the FBG returned to its original shape, which suggested that Ti-Ni SMA foil was effective to suppress the damage. However, relaxation of thermal residual tensile stress in the 90° ply was also effective. The result of the 3D FEA suggested that the suppression of damage occurrence and growth was mainly caused by the relaxation of thermal residual tensile stress.