Abstract
Every new technology node allows higher transistor density and more complex processors to be manufactured. Unfortunately, it also means that, for the same operating conditions, power density in the chip has to increase. However, it is not obvious how this increased power density translates into temperatures in the processor, therefore in this paper we analyze the influence of technology scaling on temperature of integrated circuit manufactured in FinFET technologies. The problem is discussed based on the results of both steady-state and transient thermal simulations obtained for two modern multi-core processors manufactured in 32nm and 22nm technologies.
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